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Conductive pattern formation technology using pad printing method

The formation of conductive patterns on three-dimensional curved surfaces, which was previously difficult, has become possible using the pad printing method.

We would like to introduce our "Conductive Pattern Formation Technology using Pad Printing Method." The pad printing method is a type of gravure offset printing. A printing pattern is formed in a recessed shape through etching on a flat steel plate, creating a printing plate. After applying paste (ink) over the entire surface of the plate, the unnecessary paste (ink) in the non-image areas is scraped off with a doctor blade. The paste from the plate is then transferred to a flexible rubber, such as silicone, known as a pad, which is then used to transfer the pattern onto the substrate. Since the paste (ink) is transferred using a flexible pad, printing is possible not only on flat surfaces but also on three-dimensional shapes with unevenness and other contours. 【Features】 - A printing pattern is formed in a recessed shape through etching on a flat steel plate, creating a printing plate. - Paste (ink) is transferred using a flexible pad. - Printing is possible on three-dimensional shapes with unevenness, not just flat surfaces. *For more details, please refer to the PDF document or feel free to contact us.

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PuriKen Co., Ltd. Printed Circuit Board Solder Resist Formation Technology

Microscopic openings and high-precision alignment! Formed by direct imaging method.

Smartphone chip components are becoming increasingly smaller, and product testing for 0201 sizes is actively being conducted. In printed circuit boards, the formation of micro openings and the ability for high-precision alignment have become important. At Priken, we deliver substrates that achieve both micro openings and high positional accuracy by forming solder resist openings using direct imaging methods. Please feel free to contact us if you have any requests. 【Specifications】 ■ Minimum opening size: Φ70±5μm ■ Pattern/resist clearance: 20μm ■ Mask film-less *For more details, please download the PDF or feel free to contact us.

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